Thermo-electro-mechanical coupling dynamic analysis of piezoelectric structures via stabilized node-based smoothed radial point interpolation method

The thermo-electro-mechanical coupling (TEMC) problem of the piezoelectric structure was analyzed. And the stabilized node-based smoothed radial point interpolation method (SNS-RPIM) was utilized during the computation. And the fundamental formulas were derived under thermo-mechanical load and the model of the problem was analyzed with triangular elements. The existence of thermal stress was taken into consideration. The dynamic behaviors for the TEMC problem were investigated by SNS-RPIM and finite element method (FEM) when different kinds of thermo-mechanical loadings were applied. The superiority of the proposed scheme for the TEMC problems was verified. The empirical constant was set to negative. Besides, the temperature rise can make the model softer and thermal load increase, which leads to a decrease of structural stiffness and natural frequency, thus, the displacement increases.