Interface evolution behavior of Si-based adhesive structures under tensile loading based on terahertz time-domain spectroscopy

被引：1
|
作者：
Zhong, Yi-Fan [1 ,2 ,3 ]
Li, Li-Juan [1 ,2 ,3 ]
Ren, Jiao-Jiao [1 ,2 ,3 ]
Zhang, Ji-Yang [1 ,2 ,3 ]
Zhang, Dan-Dan [1 ,2 ,3 ]
Gu, Jian [1 ,2 ,3 ]
Xue, Jun-Wen [1 ,2 ,3 ]
Chen, Qi [3 ]
机构：
[1] Changchun Univ Sci & Technol, Sch Optoelect Engn, 7089 WeixingRd, Changchun 130022, Jilin, Peoples R China
[2] Changchun Univ Sci & Technol, Sch Optoelect Engn, Key Lab Optoelect Measurement & Control & Opt Info, Minist Educ, Changchun, Peoples R China
[3] Changchun Univ Sci & Technol, Zhongshan Res Inst, Zhongshan, Peoples R China
来源：
MECHANICS OF ADVANCED MATERIALS AND STRUCTURES | 2024年 / 31卷 / 15期
关键词：
Bonding surface; Si-based adhesives; terahertz time-domain spectroscopy; nondestructive testing; scale-invariant feature transform; NUMERICAL-ANALYSIS; THICKNESS; FRACTURE; JOINTS; STRENGTH;
D O I：
10.1080/15376494.2023.2170500
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The thickness of the bonding interface changes after the structure has been subjected to tensile load, thereby affecting the strength of the bonding structure. It is necessary to monitor the evolution of the bonding interface thickness under tensile load. Through terahertz time-domain spectroscopy imaging and scale-invariant feature transform image processing, the thickness variation of three interfaces of 150 silicon-based adhesive structures under tensile load were analyzed. It was determined that variation at the edge was larger than that in the middle area. The research results also provide data support for the bonding structure health monitoring systems.
引用
收藏
页码：3185 / 3194
页数：10
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