y Microstructure and Mechanical Properties of the Joint between Si3N4 and Mo Brazed by Near-Eutectic Ag-Cu-In-Ti Filler Alloy

被引:5
|
作者
Zhao, Tong [1 ,2 ]
Mo, Defeng [1 ,2 ]
Shi, Xinmin [1 ,2 ]
Sun, Wen [1 ,2 ]
Li, Xue [1 ,2 ]
Gong, Haimei [1 ,2 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Tech Phys, Natl Key Lab Infrared Detect Technol, Shanghai 200083, Peoples R China
[2] Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
关键词
Ag-Cu-In-Ti; microstructures; Mo; Si3N4; vacuum brazings; INTERFACIAL MICROSTRUCTURE; BRAZING MECHANISM; STAINLESS-STEEL; SILICON-NITRIDE; INVAR ALLOY; EVOLUTION; CERAMICS; SURFACE; LIQUID;
D O I
10.1002/adem.202300964
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The joining of Si3N4 and Mo using Ag-Cu-In-Ti active filler alloy with the brazing temperature ranging from 720 to 860 degrees C for 10min is investigated in this article. The correlation between the joint strength and the microstructures of the brazed joints is discussed. In the results, it is shown that the activity of Ti is different at different temperatures, and thus the degree of diffusion of Ti to the interface is different. The activity of Ti gradually increases as the brazing temperature increases, and more Ti atoms diffuse into both sides of the base materials, resulting in a progressively thicker TiN thorn Ti5Si3 reaction layer on the Si3N4 ceramic side. Between 720 and 860 degrees C, the shear strength of the joint first increases and then decreases with brazing temperature. The maximum shear strength (223 MPa) is obtained at 830 degrees C.
引用
收藏
页数:9
相关论文
共 50 条
  • [1] Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag-Cu-in-Ti filler alloy
    Liu, Zhuo
    Liao, Xinjiang
    Fu, Wei
    Mu, Dekui
    Xu, Xipeng
    Huang, Han
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 790
  • [2] Microstructure and mechanical properties of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler
    He, Y. M.
    Zhang, J.
    Liu, C. F.
    Sun, Y.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (12): : 2819 - 2825
  • [3] Effect of brazing temperature on microstructure and mechanical properties of Si3N4/Si3N4 joints brazed with Ag–Cu–Ti + Mo composite filler
    Y. M. He
    J. Zhang
    X. Wang
    Y. Sun
    Journal of Materials Science, 2011, 46 : 2796 - 2804
  • [4] Effect of Ti Content on Microstructure and Mechanical Properties of Si3N4/Si3N4 Joints Brazed with Ag-Cu-Ti plus Mo Composite Filler
    Zhang, Jie
    He, Yanming
    PRICM 7, PTS 1-3, 2010, 654-656 : 2018 - 2021
  • [5] Interfacial microstructure of the Si3N4/Si3N4 joint brazed with Cu-Pd-Ti filler alloy
    Zhang, J.
    Zhou, Y.
    Naka, M.
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2006, 26 (15) : 3459 - 3466
  • [6] Effect of brazing temperature on microstructure and mechanical properties of Si3N4/Si3N4 joints brazed with Ag-Cu-Ti plus Mo composite filler
    He, Y. M.
    Zhang, J.
    Wang, X.
    Sun, Y.
    JOURNAL OF MATERIALS SCIENCE, 2011, 46 (08) : 2796 - 2804
  • [7] Microstructure and reaction phases in Si3N4/Si3N4 joint brazed with Cu-Pd-Ti filler alloy
    Zhang, J.
    Guo, Y. L.
    Naka, M.
    Zhou, Y.
    CERAMICS INTERNATIONAL, 2008, 34 (05) : 1159 - 1164
  • [8] Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
    Zhang, J
    Naka, M
    Zhou, Y
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2005, 15 (03) : 497 - 503
  • [9] Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
    张杰
    周玉
    Transactions of Nonferrous Metals Society of China, 2005, (03) : 497 - 503
  • [10] Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler
    Zhang, J.
    He, Y. M.
    Sun, Y.
    Liu, C. F.
    CERAMICS INTERNATIONAL, 2010, 36 (04) : 1397 - 1404