Advanced high voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement

被引：1
|
作者：
Kang, Seulki [1 ]
Maruyama, Kotaro [1 ]
Yamazaki, Yuichiro [1 ]
Beggiato, Matteo [2 ]
Veloso, Anabela [2 ]
Lorusso, Gian [2 ]
机构：
[1] TASMIT Inc, Yokohama, Kanagawa, Japan
[2] IMEC, Kapeldreef 75, Heverlee, Belgium
来源：
METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVII | 2023年 / 12496卷
关键词：
High voltage; E-beam metrology; on-device; Overlay; D2DB;
D O I：
10.1117/12.2661180
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
High voltage scanning electron microscopy (HV-SEM) has recently been adopted as an on-device overlay metrology tool [1,2,3]. However, the chip-manufacturing industry requests more advanced tools capable of low-distortion imaging and versatile measurement functionality for multi-layer processing. We developed a high voltage e-beam inspection (HV-EBI) tool for on-device overlay metrology that fills the abovementioned requirement. The HV-EBI tool has the capability of variable acceleration voltage in the range of 30kV to 50kV and wide field of view (FOV) imaging up to a maximum of 50 mu m with extremely low first-order distortion in the level of <0.01% and 0.1mrad and uniform in-plane beam perpendicularity. In this paper, we demonstrate the performance of on-device overlay measurement by using the proposed HV-EBI tool combined with enhanced die-to-database (D2DB) algorithm and image processor.
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页数：10
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