SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness

The thickness of the maximum undistorted chip (a(gmax)) is a crucial component of the machining arguments and significantly affects the quality of the grind. For the purpose of investigating the impact of the a(gmax) on the grinding removal properties of SiO2f/SiO2 composites, grinding experiments of SiO2f/SiO2 composites were conducted. The findings indicate that crack propagation, fiber cracking, matrix breaking, and interface debonding are the primary removal modes of SiO2f/SiO2 composites. Grinding force, surface roughness, and chip size all have a positive correlation with the maximum undeformed chip thickness. Surface brittle fracture brought on by SiO2 fiber microcrack results in little surface roughness. The surface quality degrades when bending fracture and compression fracture take place. Controlling the agmax can enhance the grinding surface quality of SiO2f/SiO2 composites.