Simulation experimental investigations into material removal mechanism of SiC ceramic by using drilling-grinding composite machining

To investigate the machining mechanism of silicon carbide (SiC) ceramic materials, this study utilized sintered diamond tools to perform drilling and grinding simulations on the material and developed a drilling model for SiC ceramic materials. By analyzing parameters such as surface morphology, stress, and cutting force, the material removal mechanism of SiC ceramic materials was revealed, and the effects of drilling parameters on cutting force, torque, and residual stress were studied. Experimental results indicate that during the abrasive cutting process, the hard contact behavior of irregular abrasive grains significantly affects material removal, leading to failure forms such as chip collapse, hole and groove cracking, and crack propagation. With an increase in the feed rate of the abrasive grains, the drilling force shows a certain range of growth patterns. The axial force is positively correlated with spindle speed and feed rate, with the feed rate having a more significant impact on the magnitude of the axial force. Additionally, as the feed rate increases, the torque also increases. The radial residual stress mainly manifests as residual tensile stress.