Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

被引：1
|
作者：
杭春进
王春青
田艳红
机构：
[1] State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology
[2] Harbin 150001
[3] State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology
来源：
China Welding | 2007年 / 03期
关键词：
copper wire bond; thermosonic bonding; ultrasonic power; bonding force; shear force;
D O I：
暂无
中图分类号：
TG146.11 [];
学科分类号：
080502 ;
摘要：
Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the efficient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.
引用
收藏
页码：46 / 50
页数：5
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