共 9 条
[1]
Fast pow-er cycling test of IGBT modules in traction application. HELD M,JACOB P,NICOLETTI G,et al. IEEE Power Electronics and Drive Systems . 1997
[2]
Si C-emerging power device tech-nology for next generation electrically powered environmentlly fridendlyvehicles. Hamada K,Nagao M,Ajioka M,et al. IEEE Transactions on Electron Devices .
[3]
Numerical and experimental thermalcharacterization of a liquid cooled Al Si C power electronics base platewith integral pin fins. Moores K A,Joshi Y K,Schiroky G. The Seventh Intersociety Conference on Thermaland Thermomechanical Phenomena in Electronic Systems . 2000
[4]
Silicon Carbide Power Transistors: A New Era in Power Electronics Is Initiated. Jacek Rabkowski,Dimosthenis Peftitsis,Hans-Peter Nee. IEEE INDUSTRIAL ELECTRONICS MAGAZINE . 2012
[5]
New compact,high performance 7th generation IGBTmodule with direct liquid cooling for EV/HEV inverters. Khalid Hussein. 30th AnnualIEEE Applied Power Electronics Conference and Exposition . 2015
[6]
Automotive battery tracker. Lux Research. . 2014
[7]
SKi N:Double side sintering tech-nology for new packages. Stockmeier T,Beckedahl P,Malzer T. 23rd International Symposium on PowerSemiconductor Devices&IC’’s . 2011
[8]
电力半导体器件原理与应用[M]. 机械工业出版社 , 袁立强, 2011
[9]
Low Temperature Sinter Technology Die Attachment for Power Electronic Applications. C.Gbl. CIPS . 2010

