Drive current of accumulation-mode p-channel SOI-based wrap-gated Fin-FETs
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张严波
[1
,2
]
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杜彦东
[1
]
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熊莹
[1
]
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杨香
[1
]
韩伟华
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Engineering Research Center for Semiconductor Integration Technology,Institute of Semiconductors,Chinese Academy of SciencesEngineering Research Center for Semiconductor Integration Technology,Institute of Semiconductors,Chinese Academy of Sciences
韩伟华
[1
]
杨富华
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Engineering Research Center for Semiconductor Integration Technology,Institute of Semiconductors,Chinese Academy of Sciences
State Key Laboratory for Superlattices and MicrostructuresEngineering Research Center for Semiconductor Integration Technology,Institute of Semiconductors,Chinese Academy of Sciences
杨富华
[1
,3
]
机构:
[1] Engineering Research Center for Semiconductor Integration Technology,Institute of Semiconductors,Chinese Academy of Sciences
[2] Department of Electronic Engineering,Tsinghua University
[3] State Key Laboratory for Superlattices and Microstructures
Comparisons are performed to study the drive current of accumulation-mode(AM) p-channel wrap-gated Fin-FETs.The drive current of the AM p-channel FET is 15%-26%larger than that of the inversion-mode (IM) p-channel FET with the same wrap-gated fin channel,because of the body current component in the AM FET, which becomes less dominative as the gate overdrive becomes larger.The drive currents of the AM p-channel wrap-gated Fin-FETs are 50%larger than those of the AM p-channel planar FETs,which arises from effective conducting surface broadening and volume accumulation in the AM wrap-gated Fin-FETs.The effective conducting surface broadening is due to wrap-gate-induced multi-surface conduction,while the volume accumulation,namely the majority carrier concentration anywhere in the fin cross section exceeding the fin doping density,is due to the coupling of electric fields from different parts of the wrap gate.Moreover,for AM p-channel wrap-gated Fin-FETs, the current in channel along <110> is larger than that in channel along <100>,which arises from the surface mobility difference due to different transport directions and surface orientations.That is more obvious as the gate overdrive becomes larger,when the surface current component plays a more dominative role in the total current.
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Tsinghua Univ, Dept Elect Engn, Beijing 100084, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Zhang Yanbo
Du Yandong
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Du Yandong
Xiong Ying
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Xiong Ying
Yang Xiang
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Yang Xiang
Han Weihua
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
Han Weihua
Yang Fuhua
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Chinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaChinese Acad Sci, Engn Res Ctr Semicond Integrat Technol, Inst Semicond, Beijing 100083, Peoples R China
机构:
Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Tsinghua Univ, Dept Elect Engn, Beijing 100084, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Zhang, Yanbo
Du, Yandong
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Du, Yandong
Chen, Yankun
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Chen, Yankun
Li, Xiaoming
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Li, Xiaoming
Yang, Xiang
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Yang, Xiang
Han, Weihua
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
Han, Weihua
Yang, Fuhua
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Chinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China
State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaChinese Acad Sci, Inst Semicond, Engn Res Ctr Semicond Integrat Technol, Beijing 100083, Peoples R China