Influence of Finishing Process Parameters of HDF Boards on Selected Properties of Coatings in Modern UV Lines and Their Relation to Energy Consumption

被引:0
|
作者
Tokarczyk, Maciej [1 ,2 ]
Lis, Barbara [1 ]
Krystofiak, Tomasz [1 ]
机构
[1] Poznan Univ Life Sci, Fac Forestry & Wood Technol, Dept Wood Sci & Thermal Tech, Wojska Polskiego 28, PL-60627 Poznan, Poland
[2] BORNE FURNITURE Co, Zlotego Smoka Str 23, PL-66400 Gorzow Wielkopolski, Poland
关键词
surface; UV lacquer system; energy; UV curing process; topography; contact angle; Wenzel coefficient; CURED COATINGS; WOOD; ADHESION; DESIGN;
D O I
10.3390/ma17225393
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This study analyzes the influence of energy generated by emitters on the adhesive properties of varnish coatings in multilayer UV systems. The experimental material, in the form of a cell board finished with UV varnish products, was prepared on a prototype line under the conditions of Borne Furniture in Gorz & oacute;w Wielkopolski. The roughness and wettability were measured using a OneAttension tensiometer integrated with a topographic module, taking into account the Wenzel coefficient. The adhesion of the examined systems was verified using the PositiTest AT-A automatic pull-off device. Energy consumption by the prototype production line was compared to the standard line, utilizing mercury emitters and mercury emitters with added gallium. Energy consumption was calculated for selected variants. The influence of the Wenzel coefficient on the wettability angle was observed. Significant differences between contact angles (CA and CAc) were noted for coatings formed with sealers (stages I and II). The largest discrepancies, reaching up to 30 degrees, were recorded at the lowest UVA and UVV doses of 26 mJ/cm2. In adhesion tests, values below 1 MPa were obtained. Insufficient energy doses in the curing process of UV systems led to delamination between the coatings. Five variants were selected where delamination within the substrate predominated (>90% A) and were characterized by the lowest energy consumption in the processes. Topographic images helped identify the presence of various surface microstructures at different stages of the production cycle. The greatest energy savings, up to 50%, were achieved in stages III and IV of the technological process.
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页数:22
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