Multi-physics simulation modeling for SiP of RF front-end with microchannel

Due to the complex structure of the heterogeneous integrated package of antenna and radio frequency (RF) front-end, it involves the coupling of electromagnetic, thermal, and force multiple physical fields. At the same time, there are also multi-scale problems in the simulation of microchannel structure and RF front-end, which greatly improves the difficulty of simulation modeling. Based on the preliminary design of an RF front-end prototype, this paper proposes a multi-physics simulation modeling method, particularly focusing on the modeling method for thermal microchannels. By establishing a multi-layer dielectric layer containing microchannels and then performing Boolean operations on the complete dielectric layer, the complete microchannels and dielectric layers are obtained. The modeling method proposed in this study can be used to predict the multi-physical field coupling relationship of the system-in-package (SiP) of RF front-end with microchannel and provides a more comprehensive and reliable simulation analysis method for electronic packaging design.