This study proposes strategies to minimize the cost of semiconductor manufacturing processes, using the total cost of ownership concept. The costs in semiconductor manufacturing are categorized into initial, operation, maintenance, downtime and production cost. Initial cost can be minimized through equipment diversification and life-cycle extension, thereby reducing capital expenditures. To reduce operation costs, a new equipment concept featuring built in valve manifold box was developed in collaboration with equipment manufacturers, significantly reducing installation costs. In addition, new methodologies were implemented to reduce energy consumption, including lowering the fan speed in the equipment front end module. Replacing existing robots with low vibration models from domestic manufacturer helped to reduce both maintenance and downtime costs by minimizing particle generation. Furthermore, equipment status monitoring and predictive maintenance should be employed wherever possible. To reduce production costs, recipe optimization activities such as minimum input steady output were conducted. Through these strategies, semiconductor manufacturing companies are able to efficiently manage costs and enhance competitiveness through reinvestment using saved capital and reduced product prices, in turn, securing long term sustainability.