Nеw рrоgrеss оf high tеmреrаturе sоldеr in еlесtrоniс расkаging

被引：0
|
作者：
Ma Y. [1 ]
Gan G. [1 ,2 ]
Luo J. [1 ]
Zhang J. [1 ]
Chen S. [1 ]
Li F. [1 ]
Li L. [2 ]
Cheng D. [2 ]
Wu Y. [3 ]
机构：
[1] Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing
[2] Golden Dragon Precise Copper Tube Group Inc, Chongqing
[3] School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2024年 / 34卷 / 02期
基金：
中国国家自然科学基金; 中国博士后科学基金;
关键词：
electronic packaging; high temperature solder; high thermal conductivity; IMC solder; nano-micron hybrid solder;
D O I：
10.11817/j.ysxb.1004.0609.2023-44349
中图分类号：
学科分类号：
摘要：
With the quick development of advanced packaging and third-generation semiconductors, high-temperature solder with high melting temperature and long-lasting temperature test has gradually become a hot spot of research, and also become a bottleneck to promote lead-free and upgrade the electronics industry and other "neck" problems. Traditional high-temperature with Sn-80Au and Pb-Sn solders, IMC solders, nano and nano-micron hybrid solders were summarized. It is proposed that high-temperature solders will definitely be dominated by gold, silver, copper, aluminum and other metals in terms of composition or graphene, carbon nanotubes and other lightweight, highly thermally conductive, high melting temperature carbon-based materials and their composites in the future. On the microscopic scale, nano-micron hybrid solder has the temperature effect of nano-solder and the flexibility of particle selection, which can solve the problems of oxidation, agglomeration and phase transition of nano-solder during sintering to a certain extent. Based on the multi-scale of particle solder and the multi-dimensional selection of particle types, IMC high-temperature solder with rapid preparation at low temperatures and long-term service at high temperatures also holds great promise. Accelerating the development of high-temperature solder, breaking through the technical bottleneck of low-temperature packaging and high-temperature service, will greatly promote the rapid development of advanced packaging and power packaging. © 2024 Central South University of Technology. All rights reserved.
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页码：357 / 387
页数：30
相关论文
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