AUTOMATED PRODUCTION, PART VARIETY IMPOSE NEW CHIP-MOUNTING REQUIREMENTS.

被引:0
|
作者
Fujita, Hisashi [1 ]
Tagami, Toshimasa [1 ]
机构
[1] TDK Corp, Jpn, TDK Corp, Jpn
来源
JEE. Journal of electronic engineering | 1985年 / 22卷 / 225期
关键词
INTEGRATED CIRCUITS - Electronics Packaging;
D O I
暂无
中图分类号
学科分类号
摘要
The wider use of chip components, for size and performance considerations, and the parallel growth of automated production, challenge makers of chip-mounting equipment with performance expectations. The paper reviews required shape characteristics of chip components and chip mounting methods.
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页码:64 / 67
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