共 50 条
- [4] Finite element analysis of stress-strain distribution characteristics in SMT solder joints (II) - dominant mechanical factor responsible for failure of solder joint Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2000, 10 (03): : 411 - 415
- [6] Finite-element analysis of solder joint strength in laser diode packaging OPTOELECTRONIC MATERIALS AND DEVICES II, 2000, 4078 : 646 - 651
- [7] Solder joint formation simulation and finite element analysis 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 436 - 443
- [8] ANALYZING THE MECHANICAL STRENGTH OF SMT ATTACHED SOLDER JOINTS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 553 - 558
- [9] ANALYZING THE MECHANICAL STRENGTH OF SMT ATTACHED SOLDER JOINTS SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 61 - 69
- [10] SOLDER JOINT MODELING USING FINITE-ELEMENT ANALYSIS PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 410 - 415