共 50 条
- [2] HIGH-DENSITY MULTIPIN CONNECTOR FOR HIGH-SPEED PULSE-PROPAGATION IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 496 - 501
- [6] High-pin-count packaging technologies for LSI devices MITSUBISHI ELECTRIC ADVANCE, 1996, 75 : 36 - 37
- [7] Is TAB the right package for high-pin-count devices? Prasad, Ray P., 1600, IHS Publ Group, Libertyville, IL, United States (09):
- [10] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS PROCEEDINGS - IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN : VLSI IN COMPUTERS & PROCESSORS, 1989, : 304 - 309