Back-end process: Step 11

被引：0
|
作者：
Abeyta, Bill
机构：
来源：
Advanced Packaging | 2000年 / 9卷 / 10期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Back-end process: Step 12
    Purdom, Ray
    Troxtell, Cles
    Zuniga, Edgar
    Advanced Packaging, 2000, 9 (10):
  • [2] Back-end process: Step 10
    Potter, Michael
    Advanced Packaging, 2000, 9 (10):
  • [3] Back-end process: Step 9
    Schmidt, Randy
    Advanced Packaging, 2000, 9 (09):
  • [4] Vision and process control for back-end assembly
    Barton, R.J.
    Schmitt, Larry
    European Semiconductor, 1994, 16 (09): : 15 - 20
  • [5] On the Mechanism of Formation of Back-End Defects in the Extrusion Process
    Valberg, Henry Sigvart
    Lefstad, Martin
    De Moraes Costa, Andre Luiz
    23RD INTERNATIONAL CONFERENCE ON MATERIAL FORMING, 2020, 47 : 245 - 252
  • [6] BACK-END IN MOTION
    LEVESQUE, JC
    EE-EVALUATION ENGINEERING, 1995, 34 (05): : 150 - 151
  • [7] Modeling the impact of back-end process variation on circuit performance
    Sylvester, Dennis
    Nakagawa, O.Sam
    Hu, Chenming
    International Symposium on VLSI Technology, Systems, and Applications, Proceedings, 1999, : 58 - 61
  • [8] Defect detection methodology on the back-end process: A case of study
    Martin, H
    Bichebois, P
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY X, 1996, 2725 : 233 - 241
  • [9] Emerging back-end opportunities
    不详
    NUCLEAR ENGINEERING INTERNATIONAL, 2014, 59 (715): : 15 - 15
  • [10] Yield management by threshold voltage adjustment in back-end process
    Ito, S
    Noguchi, K
    Horiuchi, T
    MICROELECTRONIC DEVICE TECHNOLOGY II, 1998, 3506 : 184 - 191
12345