Time-dependent ductility of electro-deposited copper

被引：0
|
作者：
Oshida, Yoshiki [1 ]
Chen, P.C. [1 ]
Reid, J.D. [1 ]
Nishihara, T. [1 ]
机构：
[1] Syracuse Univ, Syracuse, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1992年 / 114卷 / 04期
关键词：
Printed circuit boards;
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页码：448 / 454
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