Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

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[1] Nishimura, Asao
[2] Kawai, Sueo
[3] Murakami, Gen
来源：
Nishimura, Asao | 1600年 / 12期
关键词：
Alloy 42 Lead Frame - Chip Pads - Integrated-Circuit Interconnections - Lead Frame Material - Plastic-Encapsulated IC - Temperature Cycling;
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