Lead-free project focuses on electronics assemblies

被引：0
|
作者：
Bradley, Edwin
Bath, Jasbir
Whitten, Gordon
Chada, Srinivas
机构：
来源：
Advanced Packaging | 2000年 / 9卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Challenges of lead-free electronics
    Turbini, Laura J.
    SMT Surface Mount Technology Magazine, 2009, 23 (05):
  • [2] Advances in lead-free electronics soldering
    Suganuma, K
    CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE, 2001, 5 (01): : 55 - 64
  • [3] Seeking lead-free electronics alternatives
    不详
    IIE SOLUTIONS, 2002, 34 (03): : 18 - 18
  • [4] Challenges in converting to lead-free electronics
    Garner, CM
    Gupta, V
    Bissessur, V
    Kumar, A
    Aspandiar, R
    PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 6 - 9
  • [5] Probing lead-free solders in electronics
    Mehta, Rupal
    MATERIALS WORLD, 2009, 17 (08) : 14 - 14
  • [6] Are you ready for lead-free electronics?
    Eveloy, V
    Ganesan, S
    Fukuda, Y
    Wu, J
    Pecht, MG
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (04): : 884 - 894
  • [7] A review of lead-free solders for electronics applications
    Cheng, Shunfeng
    Huang, Chien-Ming
    Pecht, Michael
    MICROELECTRONICS RELIABILITY, 2017, 75 : 77 - 95
  • [8] Lead-free solder implementation for automotive electronics
    Whitten, G
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1410 - 1415
  • [9] The impact of lead-free soldering on electronics packages
    Yang, L.
    Bernstein, J.B.
    Chung, K.
    2001, Emerald (18)
  • [10] Lead-free reflow soldering for electronics assembly
    Harrison, MR
    Vincent, JH
    Steen, HAH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (03) : 21 - 38
12345