NCMS Lead-free Solder Project

被引：0
|
作者：
Prasad, Ray P. [1 ]
机构：
[1] P.O. Box 219179, Portland, OR 97225, United States
来源：
Surface mount technology | 2000年 / 14卷 / 02期
关键词：
Reliability test vehicles (RTV) - Soldering test vehicles (STV);
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] NCMS Lead-free Solder Project
    Artaki, Iris
    Noctor, Donna
    Desantis, Charles
    Desaulnier, Willie
    Felton, Lawrence
    Palmer, Mark
    Felty, Joe
    Greaves, John
    Handwerker, Carol
    Mather, John
    Schroeder, Scott
    Napp, Duane
    Pan, Tsung-Yu
    Rosser, Jerald
    Vianco, Paul
    et al.
    SMT Surface Mount Technology Magazine, 2000, 14 (02):
  • [2] Research trends in lead-free soldering in the US: NCMS lead-free solder project
    Artaki, I
    Noctor, D
    Desantis, C
    Desaulnier, W
    Felton, L
    Palmer, M
    Felty, J
    Greaves, J
    Handwerker, C
    Mather, J
    Schroeder, S
    Napp, D
    Pan, TY
    Rosser, J
    Vianco, P
    Whitten, G
    Zhu, Y
    FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 1999, : 602 - 605
  • [3] Lead-free solder
    Black, H
    CHEMISTRY & INDUSTRY, 2005, (21) : 22 - 23
  • [4] In pursuit of lead-free solder
    Birch, S
    AEROSPACE ENGINEERING, 2002, 22 (05) : 12 - 12
  • [5] The lead-free solder challenge
    Frear, Darrel
    Semicond Int, 11 (SP-20):
  • [6] The move to lead-free solder
    Woods, S
    CONNECTOR SPECIFIER, 2002, 18 (11) : 24 - 24
  • [7] Solder balling of lead-free solder pastes
    Minna Arra
    Dongkai Shangguan
    Erro Ristolainen
    Toivo Lepistö
    Journal of Electronic Materials, 2002, 31 : 1130 - 1138
  • [8] Solder balling of lead-free solder pastes
    Arra, M
    Shangguan, D
    Ristolainen, E
    Lepistö, T
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1130 - 1138
  • [9] Lead-free Flux Effect in Lead-free Solder Joint Improvement
    Leng, Eu Poh
    Ding, Min
    Ahmad, Ibrahim
    Jiun, Hoh Huey
    Hazlinda, Kamarudin
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
  • [10] Reliability of solder joints assembled with lead-free solder
    Ochiai, Masayuki
    Akamatsu, Toshiya
    Ueda, Hidefumi
    2002, Fujitsu Ltd (38):
12345