Development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly

被引:0
|
作者
Gamota, Daniel R. [1 ]
Melton, Cindy M. [1 ]
机构
[1] Motorola, Inc, Schaumburg, United States
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:183 / 187
相关论文
共 13 条
  • [1] Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly
    Gamota, Daniel
    Melton, Cindy
    IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1998, 21 (01): : 57 - 65
  • [2] Flip-chip assembly development via modified reflowable underfill process
    Miao, P
    Chew, Y
    Wang, T
    Foo, L
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 174 - 180
  • [3] Cost analysis of flip chip assembly processes: Mass reflow with capillary underfill and thermocompression bonding with nonconductive paste
    Lujan, Amy Palesko (amyl@savansys.com), 1600, IMAPS-International Microelectronics and Packaging Society (43):
  • [4] Development of Wafer Level Underfill Materials and Assembly Processes for Fine Pitch Pb-free Solder Flip Chip Packaging
    Nah, Jae-Woong
    Gaynes, Michael A.
    Feger, Claudius
    Katsurayama, Satoru
    Suzuki, Hiroshi
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1015 - 1022
  • [5] Advanced encapsulant materials systems for flip-chip-on-board assemblies .1. Encapsulant materials with improved manufacturing properties .2. Materials to integrate the reflow and underfilling processes
    Gamota, DR
    Melton, CM
    NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 1 - 9
  • [6] Development of Large Die Assembly Process Based on Simulation and Experiments of Underfill Materials Selection
    Liu, Xiaoyang
    Wu, Xiaolong
    Chen, Wenlu
    He, Ran
    Yu, Daquan
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 400 - 403
  • [7] Development of no-flow underfill materials and processes for Pb-free flip chip applications
    Prabhakumar, A
    Buckley, D
    Gillespie, P
    Mandke, S
    Mills, R
    Rubinsztajn, S
    Susarla, P
    Tonapi, S
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 353 - 358
  • [8] LEAN APPROACH TO INTEGRATE COLLABORATIVE PRODUCT DEVELOPMENT PROCESSES AND DIGITAL ENGINEERING SYSTEMS
    Vosgien, Thomas
    Jankovic, Marija
    Eynard, Benoit
    Thomas Nguyen Van
    Bocquet, Jean-Claude
    PROCEEDINGS OF THE 18TH INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN (ICED 11): IMPACTING SOCIETY THROUGH ENGINEERING DESIGN, VOL 1: DESIGN PROCESSES, 2011, 1 : 321 - 333
  • [9] Development of a C4-BGA assembly process - Innovations in C4 flux and underfill materials
    Pendse, RD
    Courtis, M
    Serrano, B
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 455 - 461
  • [10] 3D and 2.5D Packaging Assembly with Highly Silica filled One Step Chip Attach Materials for both Thermal Compression Bonding and Mass Reflow Processes
    Duffy, Daniel
    Gregory, Chris
    Breach, Christopher
    Huffman, Alan
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1803 - 1809