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- [1] Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1998, 21 (01): : 57 - 65
- [2] Flip-chip assembly development via modified reflowable underfill process 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 174 - 180
- [3] Cost analysis of flip chip assembly processes: Mass reflow with capillary underfill and thermocompression bonding with nonconductive paste Lujan, Amy Palesko (amyl@savansys.com), 1600, IMAPS-International Microelectronics and Packaging Society (43):
- [4] Development of Wafer Level Underfill Materials and Assembly Processes for Fine Pitch Pb-free Solder Flip Chip Packaging 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1015 - 1022
- [5] Advanced encapsulant materials systems for flip-chip-on-board assemblies .1. Encapsulant materials with improved manufacturing properties .2. Materials to integrate the reflow and underfilling processes NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 1 - 9
- [6] Development of Large Die Assembly Process Based on Simulation and Experiments of Underfill Materials Selection 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 400 - 403
- [7] Development of no-flow underfill materials and processes for Pb-free flip chip applications PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 353 - 358
- [8] LEAN APPROACH TO INTEGRATE COLLABORATIVE PRODUCT DEVELOPMENT PROCESSES AND DIGITAL ENGINEERING SYSTEMS PROCEEDINGS OF THE 18TH INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN (ICED 11): IMPACTING SOCIETY THROUGH ENGINEERING DESIGN, VOL 1: DESIGN PROCESSES, 2011, 1 : 321 - 333
- [9] Development of a C4-BGA assembly process - Innovations in C4 flux and underfill materials 1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 455 - 461
- [10] 3D and 2.5D Packaging Assembly with Highly Silica filled One Step Chip Attach Materials for both Thermal Compression Bonding and Mass Reflow Processes 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1803 - 1809