HYBRIDS THICK FILM SCREENING DEMANDS CONTROL.

The screen printing of thick film ink onto a hybrid substrate, regardless of the substrate material involved, can be compared to an extrusion process in which a hole is first pumped full of material, then its sides are removed. Thus, the screened-on material is left to stand on the bottom and retain the shape of the hole. Although there have been refinements over the past 40 years in precision screen printing of thick films for electronic circuits, certain fundamental aspects of the process remain constant. This article discusses how an accurate control over screening variables and communication between equipment modules allows production of increasingly dense screened-on hybrid circuitry.