TRENDS IN PACKAGING.

被引：0

作者：

Val, Christian M. ^{[1
]}

机构：

[1] Thomson-CSF, Velizy, Fr, Thomson-CSF, Velizy, Fr

来源：

International Journal of Microcircuits and Electronic Packaging | 1984年 / 7卷 / 02期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT MANUFACTURE

引用

页码：21 / 34

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