Benchmarking chip-scale packages

被引：0
|
作者：
Tech-Lead Corp, Evergreen, United States [1 ]
机构：
来源：
Circ Assem | / 6卷 / 6pp期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Stacking chip-scale packages
    Goodwin, P
    SOLID STATE TECHNOLOGY, 2005, 48 (06) : 26 - +
  • [2] Side mounting shrinks chip-scale packages
    Chin, S
    ELECTRONIC PRODUCTS MAGAZINE, 1999, 41 (12): : 23 - 23
  • [3] Failure analysis challenges for chip-scale packages
    Li, Susan
    Electronic Device Failure Analysis, 2013, 15 (02): : 14 - 21
  • [4] Multidimensional chemical sensors for chip-scale electronic packages
    Sargent, A
    Gaudiello, J
    Sadik, OA
    ELECTRO-OPTIC, INTEGRATED OPTIC, AND ELECTRONIC TECHNOLOGIES FOR ONLINE CHEMICAL PROCESS MONITORING, 1999, 3537 : 119 - 129
  • [5] Organic Chip-scale Physics Packages for MEMS Atomic Clocks
    Park, Jongchelp
    Kim, Tae Hyun
    Yang, Chung-Mo
    Kim, Hee Yeoun
    Kwon, Taeg Yong
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 897 - 902
  • [6] Assembly-level reliability characterization of chip-scale packages
    Lall, P
    Banerji, K
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 482 - 494
  • [7] MicroJet printing of solder and polymers for multi-chip modules and chip-scale packages
    Hayes, Donald J.
    Wallace, David B.
    Cox, W. Royall
    Proceedings of SPIE - The International Society for Optical Engineering, 3830 : 242 - 247
  • [8] MicroJet printing of solder and polymers for multi-chip modules and chip-scale packages
    Hayes, DJ
    Wallace, DB
    Cox, WR
    1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS, 1999, 3830 : 242 - 247
  • [9] Cyclic bending reliability of wafer-level chip-scale packages
    Lai, Yi-Shao
    Wang, Tong Hong
    Tsai, Han-Hui
    Jen, Ming-Hwa R.
    MICROELECTRONICS RELIABILITY, 2007, 47 (01) : 111 - 117
  • [10] Channel Characterization for Chip-scale Wireless Communications within Computing Packages
    Timoneda, Xavier
    Cabellos-Aparicio, Albert
    Manessis, Dionysios
    Alarcon, Eduard
    Abadal, Sergi
    2018 TWELFTH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS), 2018,
12345