HIGH-DENSITY BOARD FABRICATION TECHNIQUES.

被引：6

作者：

Bupp, J.R.

Chellis, L.N.

Ruane, R.E.

Wiley, J.P.

机构：

来源：

关键词：

Compendex;

D O I：

10.1147/rd.263.0306

中图分类号：

学科分类号：

摘要：

PRINTED CIRCUITS

引用

页码：306 / 317

共 50 条

[1] HIGH-DENSITY MULTIWIRE BOARD
SUZUKI, K
YAMAWAKI, T
NOGUCHI, S
GOTOH, T
NEC RESEARCH & DEVELOPMENT, 1981, (61): : 24 - 31
[2] FABRICATION OF HIGH-DENSITY MULTICHIP MODULES
RECHE, JJH
SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 104 - 109
[3] FABRICATION OF HIGH-DENSITY MULTICHIP MODULES
RECHE, JJH
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 565 - 569
[4] Ending the loneliness of the high-density board designer
Edwards, Chris
IEE Electronics Systems and Software, 2004, 2 (06): : 24 - 25
[5] HIGH-DENSITY MULTILAYER PRINTED WIRING BOARD
KOBUNA, H
NOGUCHI, S
ATARASHI, T
NEC RESEARCH & DEVELOPMENT, 1979, (53): : 30 - 35
[6] Redundancy techniques for high-density DRAMs
Horiguchi, M
SECOND ANNUAL IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON, 1997 PROCEEDINGS, 1997, : 22 - 29
[7] High-density gridding: Techniques and applications
Southern, EM
CURRENT OPINION IN BIOTECHNOLOGY, 1996, 7 (01) : 85 - 88
[8] ERASURE TECHNIQUES FOR HIGH-DENSITY RECORDING
CHRISTENSEN, ER
FINKELSTEIN, BI
IEEE TRANSACTIONS ON MAGNETICS, 1985, 21 (05) : 1377 - 1379
[9] High-density gridding: techniques and applications
Curr Opin Biotechnol, 1 (85):
[10] Enzymatic Fabrication of High-Density RNA Arrays
Wu, Cheng-Hsien
Holden, Matthew T.
Smith, Lloyd M.
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2014, 53 (49) : 13514 - 13517