Problems of Thermal Stresses in Structures of Electronic Subsystems.

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作者：
Dutkowski, Hieronim
Paczkowski, Eugeniusz
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| 1978年 / 19卷 / 10期
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摘要：
The problem of thermal stresses in electronic components especially in inductive components with ferrite cores is discussed. Several methods for stress elimination (at least partially) are described. It has been shown that the most effective method is based on introducing an elastic layer between a component and its external cover.
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页码：419 / 424
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