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- [3] DAMAGE FORMED ON SILICON SURFACE BY HELICON WAVE PLASMA-ETCHING JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (4A): : L536 - L538
- [4] Etching characteristics in helicon wave plasma PLASMA SOURCES SCIENCE & TECHNOLOGY, 1993, 2 (01): : 11 - 13
- [5] Effects of helicon-wave-plasma etching on the charging damage of aluminum interconnects JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (07): : 3867 - 3870
- [6] Effects of helicon-wave-plasma etching on the charging damage of aluminum interconnects Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1998, 37 (07): : 3867 - 3870
- [7] Etching characteristics by M = 0 helicon wave plasma Tsukada, Tsutomu, 1600, JJAP, Minato-ku, Japan (33):
- [9] AL ETCHING CHARACTERISTICS EMPLOYING HELICON WAVE PLASMA JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 (6B): : 3019 - 3022