REACTIVE ION ETCHING INDUCED CORROSION OF Al AND Al-Cu FILMS.

被引：0
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作者：
Lee, Wen Yaung
Eldridge, J.M.
Schwartz, G.C.
机构：
[1] IBM Research Laboratory, San Jose, CA 95193, United States
[2] IBM System Product Division, East Fishkill, NY 12533, United States
来源：
| 1600年 / 52期
关键词：
ALUMINUM AND ALLOYS - Corrosion - ALUMINUM COPPER ALLOYS - Corrosion - ELECTRIC CONDUCTORS;
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