MULTIWIRE TECHNIQUES.

Over the last decade, Multilayer printed wiring boards have satisfied the demand for dense and complex interconnection systems. With increasing sophistication of design, and a decrease in the quantity of parts per type required, tooling costs and design time have increased dramatically, with deliveries becoming more and more extended. Competitive interconnection techniques have achieved considerable success in providing an alternative approach to these problems, and the Multiwire system is gaining increasing recognition in this area. This paper discusses the Multiwire manufacturing techniques and specific equipment required, together with the necessary wiring information preparation. The technical performance of boards produced using this process, together with the economic factors involved, are detailed.