GOLD TIN INTERMETALLIC COMPOUND FORMATION IN 60/40 SOLDER APPLIED TO GOLD PLATED SUBSTRATES.

被引：0
|
作者：
Brothers, E.W.
Coleman, W.R.
Block, R.J.
机构：
来源：
| 1980年 / Metall Soc of AIME, Warrendale, Pa卷
关键词：
Intermetallics;
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暂无
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学科分类号：
摘要：
AuSn//4 intermetallic compounds were formed when 60/40 solder was applied to gold plated connectors and terminals. The tendency to form damaging layers at the solder-substrate interface was minimized by reducing the thickness of the plating so that it dissolves in the molten solder. Joint dewetting is discussed in terms of intermetallic compound formation. The role of polymer codeposition in producing porosity in solder joints is also considered.
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