SURFACE PREPARATION GUIDELINES FOR STEEL SUBSTRATES.

被引：0
|
作者：
Windsor, Barry [1 ]
机构：
[1] Corroless Int Ltd, Mitcham, Engl, Corroless Int Ltd, Mitcham, Engl
来源：
| 1600年 / 38期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
STEEL
引用
收藏
相关论文
共 50 条
  • [1] THERMOPLASTIC SUBSTRATES.
    Hastie, William M.
    Circuits Manufacturing, 1985, 25 (10): : 31 - 32
  • [2] SOME PROBLEMS IN THE PREPARATION OF SUPERCONDUCTING OXIDE FILMS ON CERAMIC SUBSTRATES.
    Koinuma, Hideomi
    Kawasaki, Masashi
    Hashimoto, Takuya
    Nagata, Shunroh
    Kitazawa, Koichi
    Fueki, Kazuo
    Masubuchi, Kiyomi
    Kudo, Masahiro
    1600, (26):
  • [3] WATER ADSORPTION AND SURFACE CONDUCTIVITY MEASUREMENTS ON alpha -ALUMINA SUBSTRATES.
    Yan, Ben-Da
    Meilink, Sandra L.
    Warren, Garry W.
    Wynblatt, Paul
    IEEE transactions on components, hybrids, and manufacturing technology, 1987, CHMT-10 (02): : 247 - 251
  • [4] FINISHING FOAMED SUBSTRATES.
    Nixon, O.Gene
    American Society of Mechanical Engineers (Paper), 1975, : 65 - 73
  • [5] COATINGS FOR PLASTIC SUBSTRATES.
    Hoffman, Edward P.
    Technical Paper - Society of Manufacturing Engineers. FC, 1977,
  • [6] ELECTROLYTIC STRIPPING OF NICKEL AND OTHER METAL COATINGS FROM STEEL SUBSTRATES.
    O'Grady, J.
    Transactions of the Institute of Metal Finishing, 1981, 59 (03): : 110 - 112
  • [7] VIABLE CONTROLLED TECHNIQUE FOR THE SURFACE CONDITIONING OF LOW WETTABLE SUBSTRATES.
    Kyhl, Henry C.
    Technical Paper - Society of Manufacturing Engineers. FC, 1980, (80-558):
  • [8] Preparation and characterization of fly ash for use as ceramic coatings on metallic substrates.
    Chavez, A.
    Vargas, G.
    Almanza, J. M.
    BOLETIN DE LA SOCIEDAD ESPANOLA DE CERAMICA Y VIDRIO, 2008, 47 (06): : 333 - 338
  • [9] Drifts study of solution phase preparation of reversed phase HPLC substrates.
    Romero, AA
    Garcia, IJ
    Murphy, KM
    Proctor, KG
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1999, 217 : U465 - U466
  • [10] TODAY'S SUBSTRATES.
    Murray, Jerry
    Circuits manufacturing, 1987, 27 (11): : 25 - 28
12345