Delamination strength of Cu thin film characterized by nanoscale stress field near interface edge

被引：0
|
作者：
Kitamuma, Takayuki [1 ]
Hirakata, Hiroyuki [1 ]
Itsuji, Takashi [1 ]
机构：
[1] Graduate School of Engineering, Kyoto University, Yoshidahommachi, Sakyo-ku, Kyoto-shi, Kyoto, 606-8501, Japan
来源：
Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2002年 / 68卷 / 01期
关键词：
Delamination tests - Film thickness - Free edge - Interface strength - Nanomechanics;
D O I：
10.1299/kikaia.68.119
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：119 / 125
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