Bonded bi-material half-planes with semi-elliptical notch under tension along the interface

被引：0
|
作者：
Hasebe, Norio [1 ]
Okumura, Mikiya [1 ]
Nakamura, Takuji [1 ]
机构：
[1] Nagoya Inst of Technology, Nagoya, Japan
来源：
Journal of Applied Mechanics, Transactions ASME | 1992年 / 59卷 / 01期
关键词：
Mathematical Techniques - Finite Element Method - Stresses - Shear;
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学科分类号：
摘要：
A problem of two bonded, dissimilar half-planes containing an ellipitical hole on the interface is solve. The external load is uniform tension parallel to the interface. A rational mapping function and complex stress functions are used and an analytical solution is obtained. Stress distributions are shown. Stress concentration factors are also obtained for arbitary lengths of debonding and for several material constants. In addition, an approximate expression of the stress concentration factor is given for elliptical holes and the accuracy is investigated.
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页码：77 / 83
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