Two-dimensional thermal stress analysis in butt adhesive joints containing hole defects and rigid fillers in adhesive

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Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 1996年 / 62卷 / 594期

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10.1299/kikaia.62.466

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页码：466 / 473

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[1] Two-dimensional thermal stress analysis in adhesive butt joints containing hole defects and rigid fillers in adhesive under non-uniform temperature field
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