Alternate metal virtual ground (AMG)--A new scaling concept for very high-density EPROM'S

被引:0
|
作者
Eitan, Boaz [1 ]
Kazerounian, R. [1 ]
Bergemont, A. [1 ]
机构
[1] Waferscale Integration, Inc,, Fremont, CA, USA
来源
Electron device letters | 1991年 / 12卷 / 08期
关键词
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
A new erasable programmable read-only memory (EPROM) array concept that reduces the cell size to the poly pitch in both directions is introduced. The key concepts that made the dramatic scaling possible are the virtual ground array with one metal line for every two diffusion bit lines, the segmentation of every other bit line, and the fieldless array. The cell size on 0.8-μm technology is 2.56 μm2 and a 1-μm2 cell is under development on a 0.5-μm technology for the 64-Mb product. These cells are smaller by a factor of 2-3 than the standard EPROM cell on the same technology. The new array concept and its advantages are expandable to flash memories.
引用
收藏
页码:450 / 452
相关论文
共 33 条
  • [1] ALTERNATE METAL VIRTUAL GROUND (AMG) - A NEW SCALING CONCEPT FOR VERY HIGH-DENSITY EPROMS
    EITAN, B
    KAZEROUNIAN, R
    BERGEMONT, A
    IEEE ELECTRON DEVICE LETTERS, 1991, 12 (08) : 450 - 452
  • [2] A NOVEL ISOLATION SCHEME FOR IMPLEMENTATION IN VERY HIGH-DENSITY AMG EPROM AND FLASH EEPROM ARRAYS
    WOLSTENHOLME, GR
    BERGEMONT, A
    MICROELECTRONIC ENGINEERING, 1992, 19 (1-4) : 253 - 256
  • [3] AN ASYMMETRICAL LIGHTLY DOPED SOURCE CELL FOR VIRTUAL GROUND HIGH-DENSITY EPROMS
    YOSHIKAWA, K
    MORI, S
    NARITA, K
    ARAI, N
    OHSHIMA, Y
    KANEKO, Y
    ARAKI, H
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (04) : 1046 - 1051
  • [4] Mastering high-density optical disks: a new concept design
    Spronck, JW
    El-Husseini, MH
    Jabben, L
    Overschie, PM
    Hobbelen, DGE
    du Pau, P
    Polinder, H
    van Eijk, J
    ASSEMBLY AUTOMATION, 2004, 24 (04) : 406 - 415
  • [5] NEW HIGH-DENSITY MULTISTANDARD RF-CONCEPT FOR VCR
    MAIER, GM
    FISCHER, B
    SELZ, A
    LANCE, J
    TEY, TF
    IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 1992, 38 (03) : 389 - 393
  • [6] A new control concept for high-density chest consistency control
    Thomasson, F
    PROCESS CONTROL, ELECTRICAL & INFORMATION CONFERENCE ISA PUPID 38TH ANNUAL SYMPOSIUM, 1998, : 473 - 482
  • [7] NOVEL TRENCH-ISOLATED BURIED N + FAMOS TRANSISTOR SUITABLE FOR HIGH-DENSITY EPROM`S.
    Esquivel, Agerico L.
    Mitchell, Allan T.
    Paterson, James L.
    Douglas, M.
    Tigelaar, H.L.
    Riemenschneider, Bert R.
    Coffman, Tim M.
    Gill, M.
    Lahiry, R.
    McElroy, D.
    Shah, P.
    Electron device letters, 1987, EDL-8 (04): : 146 - 147
  • [8] NEW STRUCTURED METAL-IN-GAP HEAD FOR HIGH-DENSITY AND HIGH TRANSFER RATE RECORDINGS
    KURIYAMA, T
    NITTA, A
    KANAI, Y
    OKI, N
    NOJIMA, T
    SAITO, S
    IEEE TRANSACTIONS ON MAGNETICS, 1993, 29 (06) : 3900 - 3902
  • [9] ESTABLISHMENT OF AN AUTOMATED ASSAY FOR CHOLESTEROL UPTAKE CAPACITY, A NEW CONCEPT OF HIGH-DENSITY LIPOPROTEIN FUNCTIONALITY
    Murakami, K.
    Kiriyama, M.
    Kubo, T.
    Saiki, N.
    Miwa, K.
    Irino, Y.
    Toh, R.
    Hirata, K. I.
    Harada, A.
    ATHEROSCLEROSIS, 2019, 287 : E222 - E222
  • [10] A New Modifier Prepared and It's Applied in High-density polyethylene/Anhydrite Composites
    Wang, Shaohui
    ADVANCED MATERIALS, PTS 1-3, 2012, 415-417 : 390 - 394