Bonding adhesive joints with radio-frequency dielectric heating

被引：0
|
作者：
机构：
[1] Li, C.
[2] Dickie, R.A.
来源：
Li, C. | 1600年 / 11期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] BONDING ADHESIVE JOINTS WITH RADIOFREQUENCY DIELECTRIC HEATING
    LI, C
    DICKIE, RA
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1991, 11 (04) : 241 - 246
  • [2] Using Radio-Frequency Fields for Local Heating and Curing of Adhesive for Bonding Metals
    Vashisth, Aniruddh
    Auvil, Tyler J.
    Sophiea, Daniel
    Mastroianni, Sarah E.
    Green, Micah J.
    ADVANCED ENGINEERING MATERIALS, 2021,
  • [3] DIELECTRIC HEATING - CONTROLLED DRYING WITH RADIO-FREQUENCY HEATING
    不详
    ENGINEERING MATERIALS AND DESIGN, 1977, 21 (01): : 51 - 51
  • [4] DIELECTRIC HEATING IN INDUSTRY APPLICATION OF RADIO-FREQUENCY AND MICROWAVES
    HULLS, P
    SHUTE, R
    IEE PROCEEDINGS-A-SCIENCE MEASUREMENT AND TECHNOLOGY, 1981, 128 (09): : 583 - 588
  • [5] LABORATORY DRYING OF HERBAGE BY RADIO-FREQUENCY DIELECTRIC HEATING
    MERRIDEW, JN
    RAYMOND, WF
    BRITISH JOURNAL OF APPLIED PHYSICS, 1953, 4 (FEB): : 37 - 39
  • [6] RADIO-FREQUENCY HEATING
    BARFIELD, RH
    PROCEEDINGS OF THE INSTITUTION OF ELECTRICAL ENGINEERS-LONDON, 1950, 97 (45): : 28 - 28
  • [7] RADIO-FREQUENCY HEATING
    HARTSHORN, L
    NATURE, 1946, 157 (3993) : 607 - 610
  • [8] Wafer level bonding using localized radio-frequency induction heating
    MingXiang Chen
    WenMing Liu
    YanYan Xi
    ChangYong Lin
    Sheng Liu
    Science China Technological Sciences, 2010, 53 : 1252 - 1257
  • [9] Wafer level bonding using localized radio-frequency induction heating
    Chen MingXiang
    Liu WenMing
    Xi YanYan
    Lin ChangYong
    Liu Sheng
    SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2010, 53 (05) : 1252 - 1257
  • [10] Wafer level bonding using localized radio-frequency induction heating
    CHEN MingXiang1
    2 Division of MOEMS
    Science China(Technological Sciences), 2010, (05) : 1252 - 1257
12345