Effect of active metal on bonding characteristics and interfacial structure of the Si3N4/Si3N4 joints brazed by Ag-Cu filler metal

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Morizono, Yasuhiro [1 ]
Nakata, Takashi [1 ]
Nishida, Minoru [1 ]
Chiba, Akira [1 ]
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[1] Kumamoto Univ, Kumamoto-shi, Japan
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页码:810 / 815
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