Chip-scale packaging primer

被引：0

作者：

Malatesta, James

Bauer, Ron

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Printed Circuit Design | 2000年 / 17卷 / 03期

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[1] Assembly chip-scale packaging
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[2] A bright future for chip-scale packaging
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[3] Application realities of chip-scale packaging
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[4] CHIP-SCALE PACKAGING COMES TO THE FOREFRONT
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[5] Chip-Scale Packaging for Bioelectronic Implants
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[6] Chip-scale packaging halves DRAM size
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[7] Chip-scale packaging approach cuts losses
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MICROWAVES & RF, 2008, 47 (05) : 58 - 58
[8] Chip-scale packaging gets tougher and tinier
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[9] Reliable hermetic MEMS chip-scale packaging
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Dubois, M. -A
Neels, A.
Dommann, A.
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[10] Chip-scale packaging is ready for prime time
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