Taking out the heat

被引：0

作者：

Fitton, G.L.

机构：

来源：

Electronic Engineering (London) | 1973年 / 45卷 / 550期

关键词：

Electronics packaging - Heat pipes;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Problems associated with dissipating heat generated by electronic devices and sub-assemblies are discussed. A novel technique now being exploited is described that involves heat pipes which have temperature gradients some hundred times smaller than any known solid conductor.

引用

页码：67 / 68

共 50 条

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