APPLICATION TO LSI PACKAGES OF SiC CERAMICS WITH HIGH THERMAL CONDUCTIVITY.

被引：0
|
作者：
Ogihara, Satoru [1 ]
Yasuda, Tomio [1 ]
Otsuka, Kanji [1 ]
Kobayashi, Fumiyuki [1 ]
机构：
[1] Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
来源：
International Journal of Microcircuits and Electronic Packaging | 1985年 / 8卷 / 02期
关键词：
Compendex;
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摘要：
3
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页码：16 / 20
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