DEFLASHING ENCAPSULATED ELECTRONIC COMPONENTS.

Components leads and lead-frame devices can be deflashed by any number of chemical and abrasive systems. The preferred system depends on the degree and location of flash, tolerable flash-removal rates, and the willingness to invest in automated equipment. Chemical deflashing involves the use of a solvent to soften or loosen thin flash (resin bleed). Mechanical deflashing, which can be accomplished by one of several methods, uses abrasive media to break or erode away moderately severe to heavy flash, or to selectively deflash difficult areas.