TAPE AUTOMATED BONDING SYSTEMS.

被引：0

作者：

Keizer, Alan

Thompson, John

机构：

来源：

New Electronics | 1980年 / 13卷 / 11期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT MANUFACTURE

引用

共 50 条

[1] TAPE AUTOMATED BONDING
HACKE, HJ
F&M-FEINWERKTECHNIK & MESSTECHNIK, 1990, 98 (12): : 553 - 556
[2] TAPE AUTOMATED BONDING FOR SENSORS
EHRMANN, O
ENGELMANN, G
SIMON, J
REICHL, H
TECHNISCHES MESSEN, 1989, 56 (11): : 415 - 417
[3] TAPE AUTOMATED BONDING DEVELOPMENT
WEILER, P
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 473 - 484
[4] AN INSTALLED TAPE AUTOMATED BONDING UNIT
KURZWEIL, K
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 159 - 163
[5] AUTOMATED TAPE CARRIER BONDING FOR HYBRIDS
OSWALD, RG
MONTANTE, JM
RODRIGUESDEMIRANDA, WR
SOLID STATE TECHNOLOGY, 1978, 21 (03) : 39 - 48
[6] DENSITY UPGRADING IN TAPE AUTOMATED BONDING
KURZWEIL, K
DEHAINE, G
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1982, 10 (01): : 51 - 55
[7] INSPECTION OF TAPE AUTOMATED BONDING DEVICES
WU, FJ
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 485 - 495
[8] STATUS OF TAPE AUTOMATED BONDING.
O'Neill, Timothy G.
Semiconductor International, 1981, 4 (02) : 33 - 51
[9] TAPE AUTOMATED BONDING MOVING INTO PRODUCTION
DEHAINE, G
KURZWEIL, K
SOLID STATE TECHNOLOGY, 1975, 18 (10) : 46 - 52
[10] TRENDS IN BONDING SYSTEMS.
Takagi, Motoki
JEE, Journal of Electronic Engineering, 1982, (192): : 68 - 72