Defect isolation and characterization in contact array/chain structures by using voltage contrast effect

被引：0
|
作者：
NEC Corp, Kanagawa, Japan [1 ]
机构：
来源：
IEEE Int Symp Semicond Manuf Conf Proc | / 195-198期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Investigation of sensitivity improvement on passive voltage contrast for defect isolation
    Lee, JC
    Chen, CH
    Su, D
    Chuang, JH
    MICROELECTRONICS RELIABILITY, 2002, 42 (9-11) : 1707 - 1710
  • [2] Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation
    Hafer, Richard F.
    Stamper, Andrew
    Hsieh, Jerry
    2020 31ST ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2020,
  • [3] Defect localization using voltage contrast IDDQ testing
    Perdu, P
    Desplats, R
    MICROELECTRONICS RELIABILITY, 1999, 39 (6-7) : 1021 - 1026
  • [4] Defect localization using voltage contrast IDDQ testing
    Perdu, Philippe
    Desplats, Romain
    Microelectronics Reliability, 39 (6-7): : 1021 - 1026
  • [5] Defect Localization and Nanofabrication for Conductive Structures with Voltage Contrast in Helium Ion Microscopy
    Xia, Deying
    McVey, Shawn
    Chuong Huynh
    Kuehn, Wilhelm
    ACS APPLIED MATERIALS & INTERFACES, 2019, 11 (05) : 5509 - 5516
  • [6] Probeless voltage contrast using a focused ion beam for opens and shorts defect isolation of ultralarge scale integration technologies
    Giewont, KJ
    Hunt, DB
    Hummler, KM
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (04): : 916 - 920
  • [7] Delay defect characterization using low voltage test
    Yan, HH
    Singh, AD
    Xu, GF
    14TH ASIAN TEST SYMPOSIUM, PROCEEDINGS, 2005, : 8 - 13
  • [8] Defect Characterization in Plate Structures using Bayesian Approach
    Li, Li
    Jiao, Jingpin
    Lv, Hongtao
    He, Cunfu
    Wu, Bin
    45TH ANNUAL REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOL 38, 2019, 2102
  • [9] Contact holes in vertical electrode structures analyzed by voltage contrast-SEM and conducting AFM
    Gu, Minseon
    Hyun, Moon Seop
    Han, Moonsup
    Kim, Gyungtae
    Chang, Young Jun
    CURRENT APPLIED PHYSICS, 2023, 53 : 46 - 50
  • [10] Open-contact-failure detection of via holes by using voltage contrast
    Nishiyama, H
    Nozoe, M
    Aramaki, K
    Watanabe, O
    Ikeda, Y
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XV, 2001, 4344 : 12 - 21
12345