Imprint patterning. Emerging materials and process technology

Imprint patterning, an emerging fabrication process, simultaneously forms `U'-shaped grooves for traces and cone-shaped microvias during the image transfer process. The combination of materials specifically formulated for this process with the imprint technology can deliver benefits of finer lines/spaces for increased circuit density, en masse via formation, reduced processing steps, and greater process robustness in circuit formation registration. Dielectric film materials are optimized to work with the imprint process. In addition, the cured material exhibits a unique isotropic coefficient of thermal expansion because of the alternative technology used to replace the glass fabric. The process produces predictable and repeatable features.