HIGH-ASPECT-RATIO VIA-HOLE FILLING WITH ALUMINUM MELTING BY EXCIMER LASER IRRADIATION FOR MULTILEVEL INTERCONNECTION.

被引：0
|
作者：
Mukai, R. [1 ]
Sasaki, N. [1 ]
Nakano, M. [1 ]
机构：
[1] Fujitsu Ltd, Kawasaki, Jpn, Fujitsu Ltd, Kawasaki, Jpn
来源：
Electron device letters | 1987年 / EDL-8卷 / 02期
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摘要：
5
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页码：76 / 78
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