Measuring plating thickness using XRF

被引：0
|
作者：
Reilly, Francis [1 ]
机构：
[1] Veeco/UPA Technology, Plainview, United States
来源：
Products Finishing (Cincinnati) | 1995年 / 59卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：70 / 76
相关论文
共 50 条
  • [1] XRF measurement of gold plating thickness
    Reilly, Francis
    Metal Finishing, 1995, 93 (05): : 33 - 35
  • [2] MEASURING NICKEL PLATING THICKNESS USING THE HALL EFFECT.
    Silverman, William
    Electronic Packaging and Production, 1982, 22 (01): : 129 - 139
  • [3] MEASURING PLATING THICKNESS ON MOVING STRIP MATERIAL
    不详
    ENGINEERING MATERIALS AND DESIGN, 1978, 22 (04): : 11 - 11
  • [4] A METHOD OF MEASURING PLATING THICKNESS ON AN IRREGULAR SURFACE
    POSOCCO, AJ
    PLATING AND SURFACE FINISHING, 1986, 73 (11): : 24 - 24
  • [5] MEASURING PLATING THICKNESS WITH X-RAY-FLUORESCENCE
    BUSH, GT
    STEBEL, MD
    PLATING AND SURFACE FINISHING, 1983, 70 (09): : 80 - 84
  • [6] A new method for detecting lithium plating by measuring the cell thickness
    Bitzer, Bernhard
    Gruhle, Andreas
    JOURNAL OF POWER SOURCES, 2014, 262 : 297 - 302
  • [7] In the thick of things - Measuring plating thickness has many variables
    Altmayer, F
    PLATING AND SURFACE FINISHING, 2004, 91 (09): : 28 - 29
  • [8] Coating thickness of plated objects using XRF technique concentrations
    Brocchieri, J.
    Sabbarese, C.
    NUOVO CIMENTO C-COLLOQUIA AND COMMUNICATIONS IN PHYSICS, 2020, 43 (06):
  • [9] Determination of layer thickness with μXRF
    Vogt, C
    Dargel, R
    APPLIED SURFACE SCIENCE, 2005, 252 (01) : 53 - 56
  • [10] Simultaneous Measurement for Thickness and P Content of an Electroless Ni/Au Plating Film on Printed Circuit Board by XRF Spectrometry
    Ohgaki, Masataka
    Izumiyama, Masaki
    Fukai, Takayuki
    BUNSEKI KAGAKU, 2020, 69 (09) : 515 - 520
12345