共 50 条
- [1] Environmental effects on Cu/SiO2 and Cu/Ti/SiO2 thin film adhesion MATERIALS RELIABILITY IN MICROELECTRONICS IX, 1999, 563 : 269 - 274
- [2] Effect of annealing on preferred orientations in the Cu/SiO2 and Cu/SiO2/Si(100) interfaces MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 479 (1-2): : 112 - 116
- [6] The effects of Cu diffusion in Cu/TiN/SiO2/Si capacitors JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (10): : 5792 - 5795
- [8] Bias-temperature stress analysis of Cu/ultrathin Ta/SiO2/Si interconnect structure JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (05): : 2286 - 2290