Reflow soldering to gold

被引：0
|
作者：
机构：
[1] Banks, Sherman
来源：
Banks, Sherman | 1600年 / Cahners Publ Co, Des Plaines, IL, United States卷 / 35期
关键词：
Organic solder protection - Plating thickness - Reflow soldering - Solderability - Solderability protection - Wire bonding;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Reflow soldering to gold
    Banks, Sherman
    Electronic Packaging and Production, 1995, 35 (06):
  • [2] On Reflow Soldering Process and Reflow Profile
    Gui, Xulong
    Zhang, Zongyang
    Xu, Ling
    Liu, Sheng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 865 - 870
  • [3] Clean reflow soldering
    Filleul, Maria
    EP Electronic Production (London), 1990, 19 (05): : 10 - 12
  • [4] THE RELIABILITY OF REFLOW SOLDERING BY HOT AIR REFLOW
    KOJIMA, Y
    KIKUCHI, M
    MATSUNAGA, K
    YAMAZAKI, N
    SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 43 - 47
  • [5] Important issues in reflow soldering
    de Klein, F.J.
    Soldering and Surface Mount Technology, 1994, (16): : 26 - 30
  • [6] Numerical Simulation of Reflow Soldering
    Stadler, Michael
    2019 20TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2019,
  • [7] Selective soldering after reflow
    SEHO USA Inc, Ashland, United States
    Natl Electron Packag Prod Conf Proc Tech Program, (1297-1303):
  • [8] SPC analysis of reflow soldering
    KIC Thermal Profiling, San Diego, United States
    SMT Surf Mount Technol Mag, 11
  • [9] Foreseeing the future for reflow soldering
    Schlessmann, Heike
    McGaigue, Jack
    EP Electronic Production (London), 2003, 32 (02): : 12 - 14
  • [10] Minimizing the compromises in reflow soldering
    Vitronics Corp
    National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1996, 3 : 1147 - 1153
12345