INFLUENCE OF STOICHIOMETRY AND HYDROGEN BONDING ON THE INSULATING PROPERTIES OF PECVD SILICON NITRIDE.

被引:0
|
作者
Chaussat, C. [1 ]
Bustarret, E. [1 ]
Bruyere, J.C. [1 ]
Groleau, R. [1 ]
机构
[1] CNRS, LEPES, Grenoble, Fr, CNRS, LEPES, Grenoble, Fr
关键词
SEMICONDUCTOR DEVICES;
D O I
暂无
中图分类号
学科分类号
摘要
The aim of this work is to describe in some detail the bonding in a ternary alloy such as Si//xN//yH//z (y greater than 10 at %, z greater than 5 at %) in order to understand better the electronical behaviors observed in present samples as well as the general corresponding trends reported in the literature. In particular authors check published empirical laws for some optical parameters against their own experimental data. For this purpose, a set of one micron-thick amorphous hydrogenated Silicon Nitride samples were prepared at 320 degree C by the 50 kH//z glow discharge of a NH//3/H//2/SiH//4 mixture, in a capacitive geometry. The NH//3/SiH//4 ratio was varied between 0. 2 and 20. The total H and N profiles and mean contents were obtained from SIMS analysis and ERD, and their different bonding sites have been studied by IR transmission spectroscopy. The electronical properties of the films were investigated through optical absorption, dark conductivity and photoconductivity.
引用
收藏
页码:215 / 219
相关论文
共 50 条
  • [1] INFLUENCE OF STOICHIOMETRY AND HYDROGEN-BONDING ON THE INSULATING PROPERTIES OF PECVD SILICON-NITRIDE
    CHAUSSAT, C
    BUSTARRET, E
    BRUYERE, JC
    GROLEAU, R
    PHYSICA B & C, 1985, 129 (1-3): : 215 - 219
  • [2] Hydrogen desorption and diffusion in PECVD silicon nitride. Application to passivation of CMOS active pixel sensors
    Benoit, D.
    Regolini, J.
    Morin, P.
    MICROELECTRONIC ENGINEERING, 2007, 84 (9-10) : 2169 - 2172
  • [3] Structure, properties and application of silicon nitride.
    Hrsak, D
    Zuljevic, JS
    Cosic, M
    METALURGIJA, 1998, 37 (01): : 39 - 43
  • [4] HYDROGEN DIFFUSION IN SILICON FROM PECVD SILICON NITRIDE
    Sheoran, Manav
    Kim, Dong Seop
    Rohatgi, Ajeet
    Dekkers, H. F. W.
    Beaucame, G.
    Young, Matthew
    Asher, Sally
    PVSC: 2008 33RD IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE, VOLS 1-4, 2008, : 1168 - +
  • [5] Influence of Processing Conditions on the Microstructure and the Mechanical Properties of Reaction Sintered Silicon Nitride.
    Heinrich, Juergen
    Forschungsbericht - Deutsche Forschungs- und Versuchsanstalt fuer Luft- und Raumfahrt, 1979, (79-32):
  • [6] Influence of Silicon Powder Grain Size on Microstructure and Mechanical Properties of Reaction Bonded Silicon Nitride.
    Heinrich, Juergen
    1600, (55):
  • [7] Refraction properties of PECVD of silicon nitride film
    Kim, B
    Kim, DW
    Han, SS
    VACUUM, 2004, 72 (04) : 385 - 392
  • [8] Effects of PECVD hardware configuration on mechanical stress and stoichiometry of silicon nitride films
    Sorger, SC
    Schönherr, H
    Fathulla, A
    Speidel, E
    STRESS-INDUCED PHENOMENA IN METALLIZATION, 2004, 741 : 244 - 248
  • [9] Influence of the reactor design in the case of silicon nitride PECVD
    Caquineau, H
    Despax, B
    CHEMICAL ENGINEERING SCIENCE, 1997, 52 (17) : 2901 - 2914
  • [10] A NEW CHEMISTRY FOR LOW HYDROGEN PECVD SILICON-NITRIDE
    FLAMM, DL
    CHANG, CP
    IBBOTSON, DE
    MUCHA, JA
    SOLID STATE TECHNOLOGY, 1987, 30 (03) : 43 - 44